Title :
Solving multi-scale electromagnetic problems by domain decomposition based integral equation method
Author :
Hu, Jun ; Jiang, Ming ; Shao, Hanru ; Nie, Zaiping
Author_Institution :
Sch. of Electron. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Abstract :
In this paper, we introduced domain decomposition based integral equation (IE) methods for complicated multi-scale problems. The first multi-scale problem is solving electromagnetic scattering from a perfectly electric conductor with complicated geometry. A hybrid IE-DDM-MLFMA with Gauss-Seidel iteration is developed. As non-overlapping DDM, it has the advantage of flexible dividing domain and no buffer zone. The Gauss-Seidel iteration is proposed to update the currents on each sub-domain in real time, so the number of outer iterations is reduced greatly. The second multi-scale problem is electromagnetic analysis of large antenna array. To realize efficient solution, the tangential equivalence principle algorithm (T-EPA) combined with characteristic basis functions (CBFs) is presented. By utilizing the CBFs together with T-EPA, the analysis of large scale arrays will be more efficient with decreased unknowns compared with original T-EPA. Numerical results are shown to demonstrate the accuracy and efficiency of the present methods.
Keywords :
antenna arrays; conductors (electric); electromagnetic wave scattering; geometry; integral equations; iterative methods; matrix decomposition; CBF; Gauss-Seidel iteration; IE; MLFMA; T-EPA; antenna array; characteristic basis function; domain decomposition method; electromagnetic analysis; electromagnetic scattering; geometry; hybrid IE-DDM; integral equation method; multiscale electromagnetic problem; nonoverlapping DDM; perfectly electric conductor; tangential equivalence principle algorithm; Algorithm design and analysis; Antenna arrays; Arrays; Electromagnetic scattering; Integral equations;
Conference_Titel :
Antennas and Propagation (APCAP), 2012 IEEE Asia-Pacific Conference on
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-0666-9
DOI :
10.1109/APCAP.2012.6333166