Title :
Overmold technology applied to cavity down ultrafine pitch PBGA package
Author :
Ouimet, Sylvain ; Paquet, Marie-Claude
Author_Institution :
IBM Canada Ltd., Bromont, Que., Canada
Abstract :
The transfer molding technology is normally used for leadframe type packages and chip-up PBGA (Plastic Ball Grid Array) packages. This technology has been applied to cavity down PBGA packages where, normally, a liquid epoxy is dispensed by a needle in the cavity in order to cover the device and gold wires without exceeding the solder ball height plane. The new encapsulation approach using transfer molding process as well as the debug/qualification method and results using an ultrafine pitch wirebond PBGA process are described
Keywords :
encapsulation; fine-pitch technology; integrated circuit manufacture; integrated circuit packaging; plastic packaging; Au; ball grid array; cavity down PBGA package; debug/qualification method; encapsulation; gold wires; liquid epoxy dispensing; overmold technology; plastic BGA package; ultrafine pitch PBGA package; ultrafine pitch wirebond process; Electronics packaging; Encapsulation; Gold; Integrated circuit interconnections; Laminates; Lead; Plastic packaging; Printed circuits; Transfer molding; Wires;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678734
