DocumentCode :
1837983
Title :
TekPAC (Technical Electronic Knowledge Personal Assistant Capsule)
Author :
Weissenborn, Catherine ; Sanchez, Frank J.
Author_Institution :
Intel Corp., Rio Rancho, NM, USA
fYear :
2001
fDate :
2001
Firstpage :
29
Lastpage :
31
Abstract :
At present, data access technology for engineers and technicians is less dynamic and more static, and it can be difficult to obtain readily available information for just in time maintenance and communication, or to use technical schematics, photos and videos to capture expert knowledge in a mobile environment. A mobile tool was needed to provide best known method (BKM) information at the exact time of need without having to spend extra time searching for or locating the information. The Technical Electronic Knowledge Personal Assistant Capsule (TekPAC) interface for the Pocket PC is a device that: provides access to readily available electronic information; allows the user to perform tasks at locations with all schematics, photos, videos and BKMs readily available; integrates key interventions to raise performance of target audience; and provides an input and output module for knowledge capture
Keywords :
CAD/CAM; electronic engineering computing; integrated circuit manufacture; integrated circuit technology; multimedia computing; notebook computers; production engineering computing; software tools; BKM information; Pocket PC; Technical Electronic Knowledge Personal Assistant Capsule interface; TekPAC interface; best known method information; communication; data access technology; electronic information access; expert knowledge capture; input/output module; just in time maintenance; knowledge capture; mobile tool; schematics; target audience performance; technical photos; technical schematics; technical videos; Data engineering; Discrete cosine transforms; Etching; Graphics; Mobile communication; Navigation; Videos;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing Symposium, 2001 IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-6731-6
Type :
conf
DOI :
10.1109/ISSM.2001.962907
Filename :
962907
Link To Document :
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