Modeling Simulation and Design of Dissipative Dispersive Uniform and Nonuniform Multiconductor Interconnects

Computer aided design compatible numerical and circuit modeling techniques for the simulation of general dispersive dissipative interconnects terminated in general nonlinear loads are presented. Starting from the physical layout of multiconductor layered interconnects associated with various packages, the procedure for the evaluation of the frequency dependent equivalent distributed self and mutual line constant matrices R, L, G, C, characterizing the structures is presented. CAD techniques for the simulation of these nonlinear multiports based on the SPICE circuit model, Laplace transforms of frequency domain network functions as well as recently developed generalized method of characteristics are discussed. Several examples of layered multiconductor structures terminated in typical logic elements are included to demonstrate the delay, distortion and corss talk associated with singly and multiply excited multiports.