DocumentCode :
1838141
Title :
Accurate Modelling of MHMIC Passive Elements Yields a Successful Design and Packaging of a 20 GHz to 5 GHZ MHMIC Low-Noise Downconverter
Author :
Fikart, J.L. ; Fairbum, M. ; Minkus, E. ; Kwan, Francis
Author_Institution :
MPR Teltech Ltd., Burnaby, B.C., Canada
Volume :
22
fYear :
1992
fDate :
3-4 Dec. 1992
Firstpage :
41
Lastpage :
49
Abstract :
The MHMIC circuits described in this paper have been designed as part of a general technology development program, with some of them subsequently refined for specific applications. One example of this was a downconverter for portable transceivers operating at 20 GHz. The intended outdoor application imposed size restrictions and required that the units operate over a large temperature range. High reliability was also required. Furthermore, low noise and high gain with a very flat frequency response were dictated by overall system considerations. The focus of this paper is not the converter subsystem as such but rather the rationale behind the selection of a circuit technology suitable for applications like this and the corresponding design, modelling, packaging and, in particular, characterization and testing using techniques adaptable to automation.
Keywords :
Bonding; Circuit noise; Circuit testing; Dielectric thin films; Gallium arsenide; MMICs; Microwave integrated circuits; Packaging; Thin film circuits; Thin film inductors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
ARFTG Conference Digest-Fall, 40th
Conference_Location :
Orlando, FL, USA
Print_ISBN :
0-7803-5686-1
Type :
conf
DOI :
10.1109/ARFTG.1992.326998
Filename :
4119656
Link To Document :
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