Title :
A new low dielectric constant siloxane polymer: AccuspinR T-24
Author :
Hacker, Nigel P. ; Figge, Lisa K. ; Flores, Veronica ; Lefferts, Scott P.
Author_Institution :
AlliedSignal Adv. Microelectron. Mater., Sunnyvale, CA, USA
Abstract :
A new spin-on-polymer with excellent physical and mechanical properties is described. AccuspinR T-24 is a siloxane based polymer which has a dielectric constant of 2.5 after cure, the lowest reported for this class of materials. In addition, thick, crack-free films can be prepared which exhibit excellent planarization and gap-fill and are suitable for both subtractive aluminum and damascene processes
Keywords :
dielectric thin films; integrated circuit interconnections; integrated circuit metallisation; permittivity; polymer films; spin coating; surface treatment; Accuspin T-24 siloxane polymer; Al; crack-free films; curing; damascene processes; dielectric constant; gap-fill; mechanical properties; physical properties; planarization; siloxane polymer; spin-on-polymer; subtractive aluminum processes; Curing; Dielectric constant; Dielectric materials; Hydrogen; Inorganic materials; Optical films; Polymer films; Stress; Temperature; Thermal stability;
Conference_Titel :
Interconnect Technology Conference, 1998. Proceedings of the IEEE 1998 International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-4285-2
DOI :
10.1109/IITC.1998.704925
