Measuring Package and Interconnect Model Parameters Using Distributed Impedance

The method developed here employs time domain reflectometry (TDR) techniques to measure model parameters of a lead in an interconnect or a package. TDR techniques have been broadly used in testing interconnect networks, since reflected waveforms provide excellent visualization of the signal path and waveform features can be readily associated with physical features of the device. What has not been widely appreciated is that quantitative values of network model parameters can be as easily extracted with TDR, in a manner that can make lumped model generation for an interconnect an easy job. The technique described here will be usefbl when a device already exists, for model pnmmeter geiieration from measurements, or, in cases where theoretical models also exist, for model parameter verification.