• DocumentCode
    1838316
  • Title

    Infrared Imaging Analysis for Thermal Comfort Assessment

  • Author

    De Oliveira, F. ; Moreau, S. ; Gehin, C. ; Dittmar, A.

  • Author_Institution
    Centre Sci. et Tech. Batiment, Nantes
  • fYear
    2007
  • fDate
    22-26 Aug. 2007
  • Firstpage
    3373
  • Lastpage
    3376
  • Abstract
    Skin temperature is a relevant and effective indicator for objective evaluation of human sensations and thermal states according to the surrounding thermal stresses. Managed by skin blood flow, sympathetic nervous system (constriction and sweating), subcutaneous thermal structure and facial vein patterns, facial coetaneous temperature variability can give information non-invasively on many physiological functions. These informations are deduced from thermal images obtained by far infrared imaging (7 - 14 mum). The work presented here deals with facial thermographic image analysis. Thermal regions of interest are extracted, such as left and right front, left and right cheek, left and right periobital region. Each region is analyzed by the FFT power spectrum calculation regarding to specific spectral band.
  • Keywords
    biomedical optical imaging; biothermics; fast Fourier transforms; infrared imaging; medical image processing; skin; FFT power spectrum; facial coetaneous temperature variability; facial thermographic image analysis; facial vein patterns; human sensation; infrared imaging analysis; skin blood flow; skin temperature; subcutaneous thermal structure; sympathetic nervous system; thermal comfort assessment; thermal images; Blood flow; Humans; Image analysis; Infrared imaging; Skin; Sympathetic nervous system; Temperature sensors; Thermal management; Thermal stresses; Veins; Body Temperature; Face; Hot Temperature; Humans; Image Interpretation, Computer-Assisted; Infrared Rays; Photography; Skin Physiological Phenomena; Thermosensing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2007. EMBS 2007. 29th Annual International Conference of the IEEE
  • Conference_Location
    Lyon
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-0787-3
  • Type

    conf

  • DOI
    10.1109/IEMBS.2007.4353054
  • Filename
    4353054