Teaching electronics packaging using interactive multimedia

This paper describes a plan to augment the hands-on instruction that will take place in a developing electronics packaging instructional laboratory with interactive multimedia course materials. The hands-on lab will provide students with exposure to basic packaging substrate fabrication concepts and techniques, including interconnect design, dielectric deposition, via formation, metallization, and substrate testing. The multidisciplinary lab will be geared toward seniors and 1st-year graduate students in electrical engineering, chemical engineering, physics, chemistry and materials science. Laboratory instruction will be enhanced by an interactive multimedia educational delivery system which makes course material remotely accessible via the World-Wide Web. The lab will operate in conjunction with the Packaging Research Center (PRC) at the Georgia Institute of Technology, which is pursuing the goal of achieving strategic solutions in electronics packaging