DocumentCode :
1838392
Title :
A national course on thermal design of electronic products: recent experiences and a proposal
Author :
Joshi, Yogendra ; Bar-Cohen, Avram ; Bhavnani, Sushil
Author_Institution :
CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA
fYear :
1998
fDate :
25-28 May 1998
Firstpage :
541
Lastpage :
543
Abstract :
The concept of a national course on thermal design of electronic products was presented by the authors at the last ECTC. Since that time, additional experience has been gained on this topic through student feedback and continuing advancements in instructional technologies. The focus of the present paper is on an Internet based approach, supplemented with live interactions for the development of a series of learning modules. Advances in Internet based instructional technology and satellite tele-conferencing offer unprecedented opportunities to provide high quality learning where and when it is needed. A high degree of reconfigurability is possible, which makes lifelong learning a real possibility. The concept of a national course and its basic elements are first summarized. Examples of modules and suggested implementation methodologies are then presented. Also discussed are methods for the assessment of the effectiveness of these modules
Keywords :
Internet; computer based training; design engineering; educational courses; electronic engineering education; teleconferencing; Internet based approach; electronic products; high quality learning; instructional technologies; instructional technology; learning modules; lifelong learning; live interactions; national course; reconfigurability; satellite tele-conferencing; thermal design; Electronic packaging thermal management; Electronics packaging; Feedback; Mechanical engineering; Product design; Proposals; Rapid thermal processing; Thermal management; Thermal management of electronics; Videos;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
ISSN :
0569-5503
Print_ISBN :
0-7803-4526-6
Type :
conf
DOI :
10.1109/ECTC.1998.678746
Filename :
678746
Link To Document :
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