Lithography-less ion implantation technology for agile fab

Author

Shibata, T. ; Sugoruo, K. ; Sughihara, K. ; Okumura, K. ; Nishihashi, T. ; Kashimoto, K. ; Fujiyama, J. ; Sakurada, Y. ; Gorou, T. ; Saji, N. ; Tsunoda, M.

Author_Institution

Semicond. Co., Toshiba Corp., Kanagawa, Japan

fYear

2001

fDate

2001

Firstpage

113

Lastpage

116

Abstract

A new type of ion implanter developed for an agile fab can eliminate the processes concerned with photo resist lithography from the ion implantation process. This new ion implantation technology can reduce the row process time, footprint, and the cost of ownership to less than 1/2 that of conventional ion implantation technology. We are making further developments on this ion implanter and evaluating technical issues related to ion implantation, a technique suitable for manufacturing submicron IC devices. Based on the results of evaluating the prototype machine, we will produce the next β-machine

Keywords

integrated circuit manufacture; integrated circuit technology; ion implantation; IC manufacture; IC production; agile jab; cost of ownership reduction; footprint reduction; ion implanter; lithography-less ion implantation technology; row process time reduction; stencil mask; submicron IC devices; Agile manufacturing; Biomembranes; Costs; Electrostatics; Implants; Ion implantation; Lithography; Resists; Semiconductor device manufacture; Semiconductor devices;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Symposium, 2001 IEEE International

Conference_Location

San Jose, CA

Print_ISBN

0-7803-6731-6

Type

conf

DOI

10.1109/ISSM.2001.962927

Filename

962927