DocumentCode
1838412
Title
Packaging education for the 21st century
Author
Schutt-Ainé, José ; Cangellaris, Andreas ; Michielssen, Eric
Author_Institution
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
fYear
1998
fDate
25-28 May 1998
Firstpage
544
Lastpage
546
Abstract
Packaging and signal integrity has become a critical area in the design of high-speed communications systems and fast computers. Many research areas have emerged from industry and universities to address issues related to packaging. However, the educational infrastructure is seriously lagging. At the University of Illinois, (UIUC), an Internet-based virtual classroom is being explored for packaging education. The effort makes used of the existing infrastructure to implement a modern platform for asynchronous learning
Keywords
Internet; computer based training; electronic engineering education; packaging; Internet-based virtual classroom; University of Illinois; asynchronous learning; educational infrastructure; high-speed communications systems; industry; packaging education; signal integrity; universities; Design engineering; Educational technology; Electromagnetic analysis; Electromagnetic fields; Electromagnetic modeling; Internet; Packaging; Signal design; Visualization; World Wide Web;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location
Seattle, WA
ISSN
0569-5503
Print_ISBN
0-7803-4526-6
Type
conf
DOI
10.1109/ECTC.1998.678747
Filename
678747
Link To Document