Title :
Packaging education for the 21st century
Author :
Schutt-Ainé, José ; Cangellaris, Andreas ; Michielssen, Eric
Author_Institution :
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Abstract :
Packaging and signal integrity has become a critical area in the design of high-speed communications systems and fast computers. Many research areas have emerged from industry and universities to address issues related to packaging. However, the educational infrastructure is seriously lagging. At the University of Illinois, (UIUC), an Internet-based virtual classroom is being explored for packaging education. The effort makes used of the existing infrastructure to implement a modern platform for asynchronous learning
Keywords :
Internet; computer based training; electronic engineering education; packaging; Internet-based virtual classroom; University of Illinois; asynchronous learning; educational infrastructure; high-speed communications systems; industry; packaging education; signal integrity; universities; Design engineering; Educational technology; Electromagnetic analysis; Electromagnetic fields; Electromagnetic modeling; Internet; Packaging; Signal design; Visualization; World Wide Web;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678747
