Title :
Proposed strategies for microelectronic packaging education for next generation engineers
Author_Institution :
Dept. of Electr. Eng., Tufts Univ., Medford, MA, USA
Abstract :
Discusses several proposed strategies to integrate microelectronic packaging education in the electrical engineering curriculum at Tufts University. The strategies include some of the traditional initiatives and a novel approach for undergraduates, graduates and professionals in industry
Keywords :
educational courses; electronic engineering education; integrated circuit packaging; Tufts University; electrical engineering curriculum; graduates; microelectronic packaging; next generation engineers; packaging education; professionals; undergraduates; Educational programs; Electronic equipment testing; Electronic packaging thermal management; Electronics packaging; Laboratories; Materials processing; Microelectronics; Rapid thermal processing; Software packages; Thermal stresses;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678748
