Title :
Ku-band MMIC´s in low-cost, SMT compatible packages
Author :
Huang, H.C. ; Ezzeddine, A. ; Darwish, A. ; Hsu, B. ; Williams, J. ; Peak, S.
Author_Institution :
AMCOM Commun. Inc., Clarksburg, MD, USA
Abstract :
mm-wave components are very expensive due to the high package and assembly cost. This paper describes a 0.25 um PHEMT Ku-band 2-watt PA, and a 2.2 dB NF LNA MMIC in a low-cost SMT package ($2.00). The package has excellent thermal resistance, 0.5 C/W, return loss (20 dB), and input/output isolation (40 dB), from DC-40 GHz. We believe this is the first time such a package design is published.
Keywords :
HEMT integrated circuits; MMIC amplifiers; MMIC power amplifiers; field effect MMIC; integrated circuit packaging; surface mount technology; 0 to 40 GHz; 0.25 micron; 2 W; 2.2 dB; 20 dB; Ku-band; MM-wave component; PHEMT MMIC; SMT package; input/output isolation; low-noise amplifier; power amplifier; return loss; thermal resistance; Assembly; Bonding; Ceramics; Costs; MMICs; Millimeter wave technology; Packaging; Radio frequency; Surface-mount technology; Thermal resistance;
Conference_Titel :
Radio Frequency Integrated Circuits (RFIC) Symposium, 2002 IEEE
Conference_Location :
Seattle, WA, USA
Print_ISBN :
0-7803-7246-8
DOI :
10.1109/RFIC.2002.1012049
