Antenna on a thick resin layer of a silicon chip and a slab antenna fed by post-wall waveguide

Author

Hirokawa, Jiro ; Asano, J. ; Ando, Makoto ; Suga, R. ; Nakano, Hisamatsu ; Hirachi, Yasutake

Author_Institution

Dept. of Electr. & Electron. Eng., Tokyo Inst. of Technol., Tokyo, Japan

fYear

2012

fDate

27-29 Aug. 2012

Firstpage

201

Lastpage

202

Abstract

This paper presents two topics on antennas in packaging for millimeter-wave applications. One is on a patch antenna on a thick resin layer of a silicon chip to achieve high radiation efficiency and to try to connect a RF circuit on the opposite side of the chip through a coax-line structure. The other is a dielectric-slab antenna fed by post-wall waveguide to have about 45-degree beam-width in both the E and H planes and to achieve 46dB isolation by arraying the two antennas in the H-plane.

Keywords

antenna feeds; coaxial cables; coaxial waveguides; dielectric devices; electronics packaging; elemental semiconductors; microstrip antenna arrays; millimetre wave antenna arrays; resins; silicon; slot antenna arrays; E-planes; H-planes; RF circuit; Si; antenna array; coax-line structure; dielectric-slab antenna; millimeter-wave antenna; patch antenna; post-wall waveguide; silicon chip; thick resin layer; Antenna arrays; Antenna measurements; Resins; Silicon; Slabs; chip antenna; isolation; package; post-wall waveguide; slab antenna;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation (APCAP), 2012 IEEE Asia-Pacific Conference on

Conference_Location

Singapore

Print_ISBN

978-1-4673-0666-9

Type

conf

DOI

10.1109/APCAP.2012.6333217

Filename

6333217