Title :
Smart packages and interconnect substrates-computing functions using signal line coupling
Author :
Cao, Lipeng ; Krusius, J. Peter
Author_Institution :
Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
Abstract :
Signal transmission delays in electronic packages and integrated circuits are key factors limiting system performance. We demonstrate that certain computing functions can be achieved by manipulating signal line inductive and capacitive coupling, as well as signal line discontinuities in lossless transmission lines. Computation is performed during signal transmission. This could alleviate signal transmission delay penalties in some applications. The time domain theory underlying this approach is presented. The concepts of static and dynamic computation are proposed. The computing function is specified in a truth table. Linear least square (LLS) and heuristic algorithms are used to construct transmission line structures that perform the desired computational tasks
Keywords :
integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; substrates; time-domain analysis; transmission line theory; capacitive coupling; computing function; discontinuity; electronic package; heuristic algorithm; inductive coupling; integrated circuit; interconnect substrate; linear least square algorithm; lossless transmission line; signal line coupling; signal transmission delay; smart package; time domain theory; truth table; Coupling circuits; Delay; Distributed parameter circuits; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Propagation losses; System performance; Transmission line discontinuities; Transmission line theory;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678762
