Title :
Wideband differential antenna in package with superstrate structure at 77GHz
Author :
Tong, Z. ; Fischer, A. ; Wang, X. ; Stelzer, A. ; Maurer, L.
Author_Institution :
Inst. for Commun. & RF-Syst., Johannes Kepler Univ., Linz, Austria
Abstract :
This paper presents a novel antenna in package solution with superstrate structure at 77 GHz for automotive radar applications. Two edge-coupled patches are driven by a differential signal which supports seamless integration with differential output MMICs in a single package. The antenna has a wide bandwidth (17 GHz) and stable gain. The antenna prototypes are fabricated using Embedded Wafer Level Ball Grid Array (eWLB) packaging technology. The measurement results show that the EIRP of the package (chip + antenna) reaches 11 dBm from 75 GHz to 80 GHz. This concept is suitable for a wide area of millimeter-wave front-end applications.
Keywords :
MMIC; automotive electronics; broadband antennas; microstrip antennas; wafer level packaging; automotive radar applications; bandwidth 17 GHz; differential output MMIC; differential signal; eWLB packaging technology; edge-coupled patches; embedded wafer level ball grid array; frequency 77 GHz; superstrate structure; wideband differential antenna; Antenna measurements; Bandwidth; Broadband antennas; MMICs; Microstrip antennas; antenna in package; differential antenna; superstrate structure; wideband;
Conference_Titel :
Antennas and Propagation (APCAP), 2012 IEEE Asia-Pacific Conference on
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-0666-9
DOI :
10.1109/APCAP.2012.6333218
