Title :
Potential packaging solutions for integrated single-chip transceivers above 100 GHz
Author :
Beer, Stefan ; Zwick, Thomas
Author_Institution :
Inst. fuer Hochfrequenztech. und Elektron. (IHE), Karlsruhe Inst. of Technol. (KIT), Karlsruhe, Germany
Abstract :
This paper discusses different packaging options for integrated single-chip transceivers above 100 GHz. Multi-layer technologies, thin-film antennas and Embedded Wafer BGA packaging are shortly introduced. Using the example of a highly advanced 120-GHz monostatic Radar IC, it is then discussed which technology offers the best option to reliably package the IC.
Keywords :
electronics packaging; radar antennas; radio transceivers; embedded wafer BGA packaging; frequency 120 GHz; integrated single-chip transceivers; monostatic radar IC; multilayer technologies; packaging options; potential packaging solutions; thin-film antennas; MMICs; Microstrip antenna arrays; Packaging; Radar antennas; Slot antennas; Antennas; Millimeter wave integrated circuits; Packaging; Radar; Radiofrequency integrated circuits;
Conference_Titel :
Antennas and Propagation (APCAP), 2012 IEEE Asia-Pacific Conference on
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-0666-9
DOI :
10.1109/APCAP.2012.6333219
