Introduction to electronic packaging: an undergraduate textbook

Author

Tummala, Rao R.

Author_Institution

NSF-ERC Packaging Res Center, Georgia Inst. of Technol., Atlanta, GA, USA

fYear

1998

fDate

25-28 May 1998

Firstpage

663

Lastpage

665

Abstract

An undergraduate text book that introduces the subject of packaging in a cross-discipline and system-level fashion is proposed. It will be authored by some of the leading academic and industry experts from around the world. The proposed chapter topics include: (1) what is electronic packaging? (its importance and its markets); (2) technology drivers; (3) electrical design fundamentals; (4) thermo-mechanical design fundamentals; (5) packaging materials and processes; (6) single chip packages; (7) multi chip packages; (8) chip assembly; (9) printed wiring board (PWB); (10) chip-to-board connections; (11) discrete components; (12) optoelectronic packaging; (13) RF electronics; (14) sealing and encapsulation; (15) electrical testing; and (16) reliability

Keywords

assembling; electronic engineering education; electronic equipment testing; encapsulation; packaging; printed circuits; reliability; RF electronics; chip assembly; chip-to-board connections; cross-discipline fashion; discrete components; electrical design fundamentals; electrical testing; electronic packaging; encapsulation; multi chip packages; optoelectronic packaging; packaging materials; printed wiring board; reliability; sealing; single chip packages; system-level fashion; technology drivers; thermo-mechanical design; undergraduate textbook; Assembly; Books; Driver circuits; Electronic equipment testing; Electronic packaging thermal management; Electronics packaging; Radio frequency; Sealing materials; Thermomechanical processes; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components & Technology Conference, 1998. 48th IEEE

Conference_Location

Seattle, WA

ISSN

0569-5503

Print_ISBN

0-7803-4526-6

Type

conf

DOI

10.1109/ECTC.1998.678768

Filename

678768