Title :
Design Considerations for Digital Interconnects in Lossy Dielectric Medium
Author :
Agrawal, Amit P.
Author_Institution :
IBM, Endicott Electronic Packaging, 1701 North Street, Endicott, NY-13760
Abstract :
The design considerations for high speed digital interconnects in a printed circuit board are presented. The frequency depepndent transmission line parameters and lossy dielectric medium are considered to characterize a transmission line. A study case is considered by presenting the design considerations for microstrip printed circuit line embedded in a homogeneous dielectric medium.
Keywords :
Dielectric losses; Distributed parameter circuits; Frequency; High performance computing; Impedance; Integrated circuit interconnections; Microstrip; Packaging; Printed circuits; Propagation losses;
Conference_Titel :
ARFTG Conference Digest-Spring, 41st
Conference_Location :
Atlanta, GA, USA
Print_ISBN :
0-7803-5686-1
DOI :
10.1109/ARFTG.1993.327025
