• DocumentCode
    1838984
  • Title

    Design Considerations for Digital Interconnects in Lossy Dielectric Medium

  • Author

    Agrawal, Amit P.

  • Author_Institution
    IBM, Endicott Electronic Packaging, 1701 North Street, Endicott, NY-13760
  • Volume
    23
  • fYear
    1993
  • fDate
    34121
  • Firstpage
    113
  • Lastpage
    126
  • Abstract
    The design considerations for high speed digital interconnects in a printed circuit board are presented. The frequency depepndent transmission line parameters and lossy dielectric medium are considered to characterize a transmission line. A study case is considered by presenting the design considerations for microstrip printed circuit line embedded in a homogeneous dielectric medium.
  • Keywords
    Dielectric losses; Distributed parameter circuits; Frequency; High performance computing; Impedance; Integrated circuit interconnections; Microstrip; Packaging; Printed circuits; Propagation losses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ARFTG Conference Digest-Spring, 41st
  • Conference_Location
    Atlanta, GA, USA
  • Print_ISBN
    0-7803-5686-1
  • Type

    conf

  • DOI
    10.1109/ARFTG.1993.327025
  • Filename
    4119694
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1838984