Title :
Thermally enhanced flip-chip BGA with organic substrate
Author :
Matsushima, Hironori ; Baba, Shinji ; Tomita, Yoshihiro ; Watanabe, Masaki ; Hayashi, Eiji ; Takemoto, Yoshitaka
Author_Institution :
Dept. of IC Assembly Eng., Mitsubishi Electr. Corp., Itami, Japan
Abstract :
A thermally enhanced Flip-chip BGA package (FC-BGA) with organic substrate has been developed. The package is proud of the high thermal and electrical performance due to the flip-chip interconnections, and the optimized heat spreader attached directly on to the die. Besides, the eutectic solder bumps (Pb63wt% Sn) have realized high reliability of flip-chip interconnections, compared with the high melting point solder bumps (Pb-3wt% Sn connected with Pb-63wt% Sn)
Keywords :
flip-chip devices; organic compounds; packaging; soldering; substrates; Pb-Sn; eutectic solder bump; flip-chip BGA package; heat spreader; organic substrate; thermal characteristics; Assembly; Ceramics; Electrodes; Electronic packaging thermal management; Electronics packaging; Large scale integration; Lead; Resistance heating; Tin; Wiring;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678772
