• DocumentCode
    1839022
  • Title

    Dynamic wordline voltage swing for low leakage and stable static memory banks

  • Author

    Tawfik, Sherif A. ; Kursun, Volkan

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Wisconsin, Madison, WI
  • fYear
    2008
  • fDate
    18-21 May 2008
  • Firstpage
    1894
  • Lastpage
    1897
  • Abstract
    A new SRAM circuit technique based on dynamically adjusting the wordline voltage swing is proposed in this paper for reducing the leakage power consumption and enhancing the data stability in static memory banks. With the proposed technique, the wordline voltage swing is reduced in order to suppress the voltage disturbance at the data storage nodes during a read operation. The stability of a minimum sized standard six transistors (6T) SRAM cell is thereby significantly enhanced. Alternatively, during a write operation the wordline signal has a full voltage swing in order to achieve write-ability with a high write margin. With the proposed circuit technique, the static noise margin is enhanced by up to 122% as compared to the conventional full-voltage-swing 6T SRAM circuits with minimum sized transistors. Furthermore, the leakage power consumption with the proposed technique is reduced by 51% as compared to the conventional full-voltage-swing circuits sized for data stability in a 65nm CMOS technology.
  • Keywords
    SRAM chips; memory architecture; SRAM cell; SRAM circuit; data stability; data storage node; dynamic wordline voltage swing; leakage power consumption; random access memory; size 65 nm; static RAM; static memory banks; voltage disturbance; wordline signal; write-ability; CMOS technology; Circuit noise; Circuit stability; Degradation; Energy consumption; Leakage current; Low voltage; Microprocessors; Random access memory; Robustness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2008. ISCAS 2008. IEEE International Symposium on
  • Conference_Location
    Seattle, WA
  • Print_ISBN
    978-1-4244-1683-7
  • Electronic_ISBN
    978-1-4244-1684-4
  • Type

    conf

  • DOI
    10.1109/ISCAS.2008.4541812
  • Filename
    4541812