Title :
Ceramic ball grid array for AMD K6 microprocessor application
Author :
Master, Raj N. ; Dolbear, Thomas P. ; Cole, Marie S. ; Martin, Gregory B.
Author_Institution :
Adv. Micro Devices, AMD, Sunnyvale, CA, USA
Abstract :
Reliability of ceramic ball grid arrays has been reported in previous studies. These studies were carried out with respect to the body size and assembly parameters. This paper will report on reliability of a relatively thin package (<1 mm) in a daughter card format. This format is typical of many mobile personal computers. In addition, we will describe the effect of thickness and card pad design on the second level reliability of the ceramic ball grid array. Impact of silicon die and continuous compressive load on reliability will also be described
Keywords :
ceramics; integrated circuit packaging; integrated circuit reliability; microprocessor chips; AMD K6 microprocessor; ceramic ball grid array; compressive load; daughter card; mobile personal computer; package; reliability; silicon die; Assembly; Ceramics; Electronics packaging; Fatigue; Microcomputers; Microprocessors; Soldering; Testing; Thermal stresses; Vehicles;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678775
