• DocumentCode
    1839068
  • Title

    A robust high voltage Si LDMOS model extraction process to achieve first pass linear RFIC amplifier design success

  • Author

    Pla, J.A. ; Bridges, D.

  • Author_Institution
    Semicond. Products Sector, Motorola Inc., Tempe, AZ, USA
  • fYear
    2002
  • fDate
    3-4 June 2002
  • Firstpage
    347
  • Lastpage
    350
  • Abstract
    A robust model extraction procedure was developed for a high voltage Si LDMOS RFIC process to achieve first pass linear RFIC amplifier design success. The model extraction process utilizes pulsed isothermal small-signal S-parameter measurements and extracted large-signal Root Models at three different temperatures to extract model parameters for Motorola´s Electro-Thermal (MET) FET analytical model. Large-signal model validation was performed against loadpull measurements under 1-tone and 2-tone stimuli. Also, the models were developed into a design kit within Agilent/sup (R)/ EEsof/sup (R)/´s ADS/sup (R)/ (Advanced Design System) to design a wide-band 30 Watt power amplifier IC which achieved first pass design success.
  • Keywords
    MMIC power amplifiers; MOS analogue integrated circuits; S-parameters; circuit CAD; circuit optimisation; elemental semiconductors; equivalent circuits; field effect MMIC; integrated circuit modelling; power integrated circuits; silicon; wideband amplifiers; Si; design kit; first pass design success; high voltage LDMOS RFIC; large-signal Root Models; large-signal model validation; linear RFIC amplifier; loadpull measurements; nonlinear transistor models; pulsed isothermal small-signal S-parameter; robust model extraction procedure; two step global optimization; wideband power amplifier IC; Integrated circuit modeling; Isothermal processes; Power system modeling; Pulse amplifiers; Pulse measurements; Radiofrequency integrated circuits; Robustness; Scattering parameters; Temperature; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radio Frequency Integrated Circuits (RFIC) Symposium, 2002 IEEE
  • Conference_Location
    Seattle, WA, USA
  • ISSN
    1529-2517
  • Print_ISBN
    0-7803-7246-8
  • Type

    conf

  • DOI
    10.1109/RFIC.2002.1012064
  • Filename
    1012064