• DocumentCode
    1839073
  • Title

    Solder joint fatigue life of fleXBGATM assemblies

  • Author

    Darveaux, Robert ; Mawer, Andrew

  • Author_Institution
    Amkor Electronics, Chandler, AZ, USA
  • fYear
    1998
  • fDate
    25-28 May 1998
  • Firstpage
    707
  • Lastpage
    712
  • Abstract
    fleXBGAuTM is a chip scale package offered by Amkor. The package is based on a flex circuit (tape) substrate, and has a die up, wire bonded, over molded configuration. This paper presents board level reliability data over a wide range of variables. The performance is also compared to μBGATM TSOP packages
  • Keywords
    fatigue; integrated circuit packaging; integrated circuit reliability; lead bonding; Amkor; board level reliability data; chip scale package; fleXBGA assemblies; flex circuit substrate; over molded configuration; solder joint fatigue life; wire bonded; Apertures; Assembly; Condition monitoring; Failure analysis; Fatigue; Fingers; Packaging; Soldering; Testing; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components & Technology Conference, 1998. 48th IEEE
  • Conference_Location
    Seattle, WA
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-4526-6
  • Type

    conf

  • DOI
    10.1109/ECTC.1998.678776
  • Filename
    678776
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1839073