Reliability and failure analyses of thermally cycled ball grid array assemblies

Author

Ghaffarian, Reza ; Kim, Namsoo P.

Author_Institution

Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA

fYear

1998

fDate

25-28 May 1998

Firstpage

713

Lastpage

720

Abstract

Reliability of ball grid arrays was assessed as part of a consortium effort led by the Jet Propulsion Laboratory. Nearly 200 test vehicles, each with four packages, were assembled and tested using an experiment design. The most critical variables incorporated for the experiment were package types, ceramic and plastic; board materials, FR-4 and polyimide; surface finishes, OSP, HASL, and Ni/Au; solder volumes, low, standard, and high; and environmental conditions. This paper presents the most current thermal cycling test results (>6000 cycles) for plastic OMPAC and SuperBGA packages with 352 I/Os and 560 I/Os. Failure mechanisms detected by electrical continuity interruptions as well as optical and scanning electron microscopy results will also be compared for ceramic and plastic package assemblies

Keywords

environmental testing; failure analysis; integrated circuit reliability; integrated circuit testing; optical microscopy; plastic packaging; scanning electron microscopy; OMPAC; SuperBGA; ball grid array; board materials; ceramic package; electrical continuity interruptions; environmental conditions; failure analyses; failure mechanisms; optical microscopy; package types; plastic package; reliability; scanning electron microscopy; solder volumes; surface finishes; thermally cycled assemblies; Assembly; Ceramics; Electronics packaging; Failure analysis; Laboratories; Optical microscopy; Plastic packaging; Propulsion; Testing; Vehicles;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components & Technology Conference, 1998. 48th IEEE

Conference_Location

Seattle, WA

ISSN

0569-5503

Print_ISBN

0-7803-4526-6

Type

conf

DOI

10.1109/ECTC.1998.678777

Filename

678777