• DocumentCode
    1839121
  • Title

    Resource conservation of buffered HF in semiconductor manufacturing

  • Author

    Inagaki, Yasuhito ; Shimizu, Mineo

  • Author_Institution
    Corporate Environ. Affairs, Sony Corp., Yokohama, Japan
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    225
  • Lastpage
    228
  • Abstract
    Buffered HF (BHF), which is a mixture of hydrofluoric acid and ammonium fluoride, is used for etching and cleaning silicon wafers. Waste BHF is generally treated with a variety of chemicals, resulting in the discharge of much wastewater and sludge. We have developed a new method to extend the period of BHF can be used by supplying elements which depend on the ratio of NH4F to HF in BHF. This method can reduce the BHF required, reduce the chemicals required to treat waste BHF and decrease the discharge of wastewater and sludge
  • Keywords
    coagulation; etching; flocculation; recycling; semiconductor technology; surface cleaning; HF; HF-NH4F; buffered HF; cleaning; coagulation; etch rate; etching; flocculation; resource conservation; semiconductor manufacturing; silicon wafers; sludge; usable period; wastewater; Chemicals; Cleaning; Coagulation; Etching; Hafnium; Polymers; Semiconductor device manufacture; Silicon; Sludge treatment; Wastewater treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Symposium, 2001 IEEE International
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    0-7803-6731-6
  • Type

    conf

  • DOI
    10.1109/ISSM.2001.962954
  • Filename
    962954
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1839121