Title :
Design techniques for improved microwave performance of small outline packages
Author :
Jessie, D. ; Larson, L.
Author_Institution :
California Univ., San Diego, La Jolla, CA, USA
Abstract :
General techniques to improve the microwave performance of plastic leaded packages have been developed. These techniques result in an Improvement of the bandwidth and reduction of losses in the structure. The techniques were applied to an SSOP8 configuration, and the useful frequency range was extended from 6 GHz to well above 10 GHz.
Keywords :
integrated circuit packaging; microwave integrated circuits; plastic packaging; 6 to 15 GHz; SSOP8 configuration; X-band region; bandwidth Improvement; design techniques; high-frequency response; improved microwave performance; losses reduction; low-cost implementation; optimization; plastic leaded packages; small outline packages; Bonding; Coupling circuits; Frequency; Inductance; Microwave theory and techniques; Pins; Plastic integrated circuit packaging; Plastic packaging; Resonance; Wire;
Conference_Titel :
Radio Frequency Integrated Circuits (RFIC) Symposium, 2002 IEEE
Conference_Location :
Seattle, WA, USA
Print_ISBN :
0-7803-7246-8
DOI :
10.1109/RFIC.2002.1012072
