Title :
Thermo-mechanical analysis of solder joint fatigue and creep in a flip chip on board package subjected to temperature cycling loading
Author :
Pang, John H L ; Tan, Tze-Ing ; Sitaraman, Suresh K.
Author_Institution :
Sch. of Mech. & Production Eng., Nanyang Technol. Inst., Singapore
Abstract :
Thermo-mechanical stress analysis was conducted on a flip-chip-on-board (FCOB) package with underfill encapsulation. The solder joint fatigue and creep deformation response were modeled for a typical temperature cycling loading of -55 to 125 C. Two temperature cycling loading models with and without the curing part of the temperature history for the encapsulation process were investigated. Two-dimensional plane-strain finite element models of the FCOB package were employed. Elasto-plastic and creep deformation behavior of solder was simulated under the temperature cycling conditions to obtain the stress and strain results. The finite element strain results were used in fatigue life prediction models
Keywords :
creep; encapsulation; finite element analysis; flip-chip devices; integrated circuit packaging; plastic deformation; soldering; thermal stress cracking; -55 to 125 degC; creep deformation response; elasto-plastic deformation; encapsulation process; flip chip on board package; life prediction models; solder joint fatigue; temperature cycling loading; temperature cycling loading models; thermo-mechanical stress analysis; two-dimensional plane-strain finite element models; underfill encapsulation; Capacitive sensors; Creep; Deformable models; Encapsulation; Fatigue; Finite element methods; Packaging; Soldering; Temperature; Thermomechanical processes;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678811
