Title :
3-D Finite Element Analysis and Experimental Study on Brain Injury Mechanism
Author :
Takahashi, T. ; Kato, K. ; Ishikawa, R. ; Watanabe, T. ; Kubo, M. ; Uzuka, T. ; Fujii, Y. ; Takahashi, H.
Author_Institution :
Meiji Univ., Kawasaki
Abstract :
The purpose of this paper is to discuss the basic study of mechanism of brain injury analytically and experimentally, in respect to the frequency analysis of the pressure changes. First, a three-dimensional FEM model for impact analysis was presented. The pressure changes inside a brain agar phantom and its frequency analysis were calculated. Second, an experimental system to perform an impact experiment was presented. In the impact experiments, the pressure changes inside a brain agar phantom after impact were measured. The comparison of the computer simulation and the experimental results of the impacts showed that the negative pressure, which seemed to cause the contrecoup injury at the contrecoup side of a brain, also appeared in the contrecoup side of the brain agar phantom. Finally the results of the frequency analysis of pressure changes by FFT were presented. From the results of computer simulations and impact experiments, we found similar spectrums in some frequency bands, which seemed to be the occurrence of the brain injury.
Keywords :
brain; fast Fourier transforms; finite element analysis; impact testing; phantoms; wounds; 3-D finite element analysis; FFT; brain agar phantom; brain injury mechanism; contrecoup injury; frequency analysis; impact analysis; Biological materials; Bones; Brain injuries; Computer simulation; Finite element methods; Frequency; Humans; Imaging phantoms; Performance analysis; Resins; Brain injury; Contrecoup; FEM analysis; FFT; Frequency analysis; Impact experiment; Acceleration; Brain Injuries; Computer Simulation; Finite Element Analysis; Humans; Intracranial Pressure; Models, Biological; Physical Stimulation; Risk Assessment; Risk Factors;
Conference_Titel :
Engineering in Medicine and Biology Society, 2007. EMBS 2007. 29th Annual International Conference of the IEEE
Conference_Location :
Lyon
Print_ISBN :
978-1-4244-0787-3
DOI :
10.1109/IEMBS.2007.4353113