DocumentCode
1840016
Title
Impact of deep sub-ambient cooling on GSI interconnect performance
Author
Naeemi, Azad ; Meindl, James D.
Author_Institution
Microelectron. Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2005
fDate
6-8 June 2005
Firstpage
156
Lastpage
158
Abstract
It is shown that sub-ambient cooling can enhance the performance of GSI interconnects significantly if their design is re-optimized accordingly. Liquid-air cooling improves the latency of local interconnects significantly (e.g. 35% and 60% for 20 μm long interconnects at 45 nm and 22 nm technology nodes, respectively), and makes semiglobal interconnects more than 150% faster. It also increases the number of bits per second that global interconnects can potentially transfer by more than 100%.
Keywords
circuit optimisation; cooling; integrated circuit design; integrated circuit interconnections; thermal management (packaging); 20 micron; 22 nm; 45 nm; GSI interconnects; IC design optimization; deep sub-ambient cooling; global interconnect transfer rate; liquid-air cooling; local interconnect latency; semiglobal interconnects; Conductivity; Cooling; Copper; Cryogenics; Electrons; Integrated circuit interconnections; Integrated circuit technology; Subthreshold current; Temperature; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference, 2005. Proceedings of the IEEE 2005 International
Print_ISBN
0-7803-8752-X
Type
conf
DOI
10.1109/IITC.2005.1499961
Filename
1499961
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