• DocumentCode
    1840142
  • Title

    Design of reliable interface system for eddy current displacement sensors in vacuum environments1

  • Author

    Nabavi, Mohammad Reza ; Nihtianov, Stoyan

  • Author_Institution
    Electron. Instrum. Lab., Delft Univ. of Technol., Delft
  • fYear
    2008
  • fDate
    18-21 May 2008
  • Firstpage
    2090
  • Lastpage
    2093
  • Abstract
    In this paper we propose a reliable interface concept for eddy current displacement sensors. The implementation of a signal conditioning approach, based on simple electronic circuits, is also discussed. The interface system is designed for medium to high-resolution applications in the sub-micron displacement measurement range. The application of the sensor is in special vacuum environment with severe restrictions of power dissipation, and increased requirements for reliability and thermal drift. The new system is expected to consume less than 20 mW, and to have a very low thermal drift. The implementation will be a system-in-package (SIP). The full-scale range of the measured displacement is 1 mm with 50 KHz signal bandwidth and 11 bits resolution (less than 500 nm). The signal conditioning interface is utilizing a standard 0.35 mum CMOS technology. The discussions are based on simulations and primary experimental results, promising a proper sensor operation.
  • Keywords
    eddy currents; electric sensing devices; eddy current displacement sensor; electronic circuit; reliable interface system; signal conditioning interface; submicron displacement measurement; vacuum environment; Bandwidth; CMOS technology; Displacement measurement; Eddy currents; Electronic circuits; Power dissipation; Power system reliability; Sensor systems; Thermal sensors; Vacuum systems; displacement; eddy current; interface; low-power; low-thermal drift;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2008. ISCAS 2008. IEEE International Symposium on
  • Conference_Location
    Seattle, WA
  • Print_ISBN
    978-1-4244-1683-7
  • Electronic_ISBN
    978-1-4244-1684-4
  • Type

    conf

  • DOI
    10.1109/ISCAS.2008.4541861
  • Filename
    4541861