W-band flip-chip interconnects on thin-film substrate

Author

Schmuckle, F.J. ; Jentzsch, A. ; Oppermann, H. ; Riepe, K. ; Heinrich, W.

Author_Institution

Ferdinand-Braun-Inst., Berlin, Germany

Volume

3

fYear

2002

fDate

2-7 June 2002

Firstpage

1393

Abstract

A flip-chip approach is presented using a thin-film microstrip line (TFMSL) on silicon as the carrier substrate. Thin-film technology allows one to employ cheap low-resistivity Si wafers without degrading MM-wave performance. By means of 3D EM simulation, an optimized interconnect is designed for the 77 GHz band. Measurements of test structures up to 100 GHz demonstrate the potential of this approach.

Keywords

flip-chip devices; hybrid integrated circuits; integrated circuit interconnections; microassembling; millimetre wave integrated circuits; multichip modules; substrates; thin film circuits; 100 GHz; 3D EM simulation; 77 GHz; EHF; MM-wave performance; Si; W-band interconnects; flip-chip interconnects; low-resistivity Si wafers; optimized interconnect; thin-film microstrip line; thin-film motherboard; thin-film substrate; thin-film technology; Dielectric thin films; Frequency; Gallium arsenide; Microstrip; Reflection; Semiconductor thin films; Silicon; Substrates; Transistors; Transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2002 IEEE MTT-S International

Conference_Location

Seattle, WA, USA

ISSN

0149-645X

Print_ISBN

0-7803-7239-5

Type

conf

DOI

10.1109/MWSYM.2002.1012115

Filename

1012115