Title :
W-band flip-chip interconnects on thin-film substrate
Author :
Schmuckle, F.J. ; Jentzsch, A. ; Oppermann, H. ; Riepe, K. ; Heinrich, W.
Author_Institution :
Ferdinand-Braun-Inst., Berlin, Germany
Abstract :
A flip-chip approach is presented using a thin-film microstrip line (TFMSL) on silicon as the carrier substrate. Thin-film technology allows one to employ cheap low-resistivity Si wafers without degrading MM-wave performance. By means of 3D EM simulation, an optimized interconnect is designed for the 77 GHz band. Measurements of test structures up to 100 GHz demonstrate the potential of this approach.
Keywords :
flip-chip devices; hybrid integrated circuits; integrated circuit interconnections; microassembling; millimetre wave integrated circuits; multichip modules; substrates; thin film circuits; 100 GHz; 3D EM simulation; 77 GHz; EHF; MM-wave performance; Si; W-band interconnects; flip-chip interconnects; low-resistivity Si wafers; optimized interconnect; thin-film microstrip line; thin-film motherboard; thin-film substrate; thin-film technology; Dielectric thin films; Frequency; Gallium arsenide; Microstrip; Reflection; Semiconductor thin films; Silicon; Substrates; Transistors; Transmission lines;
Conference_Titel :
Microwave Symposium Digest, 2002 IEEE MTT-S International
Conference_Location :
Seattle, WA, USA
Print_ISBN :
0-7803-7239-5
DOI :
10.1109/MWSYM.2002.1012115
