• DocumentCode
    1840297
  • Title

    The effect of finite ground on a rectangular C-patch antenna

  • Author

    Liang, M.C. ; Lai, K.L. ; Lin, S.T.

  • Author_Institution
    Dept. of Electron. Eng., I-Shou Univ., Kaohsiung, Taiwan
  • Volume
    2
  • fYear
    2003
  • fDate
    22-27 June 2003
  • Firstpage
    732
  • Abstract
    In mobile communication antenna design, the antenna has become an integral part of the mobile device. To achieve this goal, the antenna for mobile sets must be small, flexible, and efficient. The capacitor-loaded patch, i.e., C-patch, antenna is one of the antennas that can achieve the goal of mobile communication devices. The C-patch antenna makes use of the capacitance to reduce the resonant frequency of the patch so that a small, arbitrarily shaped patch antenna can operate at proper frequencies. In previous studies, it was found that the size of ground plane has strong effects on the operation parameters of the traditional patch antenna. Although the C-patch antenna is a type of patch antenna, it is not clear whether the ground effect on the C-patch antenna is the same or not. To investigate the problem, a study of the ground plane effect on a rectangular C-patch antenna is presented in this paper. Like the traditional patch antenna, the C-patch antenna parameters are affected strongly by the ground plane effect. However, unlike the traditional patch antenna, the ground plane effect on the C-patch antenna is asymmetrical.
  • Keywords
    microstrip antennas; mobile antennas; asymmetrical ground plane effect; capacitor-loaded patch antenna; finite ground plane effects; mobile communication antenna; mobile communication devices; rectangular C-patch antenna; resonant frequency reduction; Capacitance; Design engineering; Impedance; Microstrip antennas; Mobile antennas; Mobile communication; Modems; Patch antennas; Resonant frequency; Shape;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 2003. IEEE
  • Conference_Location
    Columbus, OH, USA
  • Print_ISBN
    0-7803-7846-6
  • Type

    conf

  • DOI
    10.1109/APS.2003.1219340
  • Filename
    1219340