Development of an organic wafer-level packaging platform for highly integrated RF transceivers

We present the development of a novel organic-micromachined packaging scheme at the wafer level for highly integrated RF transceivers. This process enables the integration of on-chip passive devices and isolation structures at the wafer level. We demonstrate the development of inductors that achieve a Q-factor of about 61 at 1.7 GHz and on-chip isolation structures that provide an isolation of more than 50 dB in the GHz range.