DocumentCode :
1840321
Title :
ORMOCERsTM-new photo-patternable dielectric and optical materials for MCM-packaging
Author :
Popall, M. ; Dabek, A. ; Robertsson, M.E. ; Gustafsson, G. ; Hagel, O.-J. ; Olsowski, B. ; Buestrich, R. ; Cergel, L. ; Lebby, M. ; Kiely, P. ; Joly, J. ; Lambert, D. ; Schaub, M. ; Reichl, H.
Author_Institution :
Fraunhofer-Inst. fur Silicatforschung, Wurzburg, Germany
fYear :
1998
fDate :
25-28 May 1998
Firstpage :
1018
Lastpage :
1025
Abstract :
Hybrid inorganic-organic polymers (ORMOCERs) have been developed and tested in an ongoing EU-program (BE 7250 DONDOMCM) for evaluation in MCM applications. The photopatternable materials with negative resist behavior are composed of inorganic oxidic structures cross-linked or substituted by organic groups. They are prepared from organosilane precursors by sol-gel-processing in combination with organic crosslinking of polymerizable organic functions. As a result of these functionalities the properties of the ORMOCERs can be adjusted to particular applications. Systematic variation of composition combined with adaptation to micro system technology allows great flexibility in processing. Some features of these materials are: postbaking at moderate temperatures (120°C-180°C) enables processing on substrates such as FR-4 and BT. Combined use as dielectric and passivation layers in electrical systems and devices as well as core and cladding for optical applications enables e/o applications with high integration levels. Easily adaptable to thin film technology: spin-on with planarization >90% and via diameters down to 20 μm have been achieved
Keywords :
dielectric materials; integrated circuit packaging; multichip modules; optical polymers; passivation; photoresists; sol-gel processing; 120 to 180 degC; 20 micron; MCM-packaging; ORMOCERs; e/o applications; hybrid inorganic-organic polymers; inorganic oxidic structures; integration levels; negative resist behavior; organic crosslinking; organosilane precursors; passivation layers; photo-patternable dielectric materials; photo-patternable optical materials; postbaking; sol-gel-processing; via diameters; Dielectric materials; Dielectric substrates; Dielectric thin films; Inorganic materials; Optical materials; Organic materials; Polymers; Resists; Temperature; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
ISSN :
0569-5503
Print_ISBN :
0-7803-4526-6
Type :
conf
DOI :
10.1109/ECTC.1998.678838
Filename :
678838
Link To Document :
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