Title :
Development of 0.025 mm pitch anisotropic conductive film
Author :
Hotta, Yuji ; Maeda, Masako ; Asai, Fumiteru ; Eriguchi, Fuyuki
Author_Institution :
Core Technol. Center, Nitto Denko Corp., Osaka, Japan
Abstract :
Anisotropic conducting adhesive technology for flip chip interconnection, is being actively investigated now. We are now developing new structure of Anisotropic Conductive Film (ACF), which has been designed to be able to connect between a bump-less chip and a high density print circuit board. This paper describes the challenges encountered in the development of this new ACF
Keywords :
adhesives; conducting materials; fine-pitch technology; flip-chip devices; printed circuit manufacture; 0.025 mm; adhesive; anisotropic conductive film; flip chip interconnection; print circuit board; Adhesives; Anisotropic conductive films; Conducting materials; Electronic components; Gold; Inorganic materials; Polymer films; Printed circuits; Rough surfaces; Surface roughness;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678842
