Title :
Optimum drying method for scan coating
Author :
Kobayashi, Shinji ; Kitano, Takahiro ; Takeshita, Kazuhiro ; Sugimoto, Shinichi ; Akimoto, Masami
Author_Institution :
Tokyo Electron Kyusyu Ltd., Kumamoto, Japan
Abstract :
This paper introduces the optimum drying technology after scan coating. For this method, we adopted decompression drying method and we found it an optimum method. This is the only method, which is compatible with better thickness profile (1.9%) and rapid throughput (145 sec). The important thing in the drying process is to volatilize solvent slowly and dry the volatilized thinner to make it form a laminar flow. The thickness profile of decompression drying method is not inferior to that of spin coating
Keywords :
coating techniques; drying; evaporation; integrated circuit manufacture; surface treatment; 145 sec; IC production; ILD coating material; decompression drying method; inter-layer dielectric; laminar flow; optimum drying technology; optimum method; scan coating; semiconductor wafer processing; solvent evaporation; thickness profile; Coatings; Contamination; Electrons; Ferroelectric films; Optical films; Ovens; Solvents; Temperature control; Throughput; Valves;
Conference_Titel :
Semiconductor Manufacturing Symposium, 2001 IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-6731-6
DOI :
10.1109/ISSM.2001.963000
