The practical use of residual gas analysis in a semiconductor thermal processing module

Author

Hashem, Jimmy ; Bradshaw, Brian

Author_Institution

Texas Instrum. Inc., Dallas, TX, USA

fYear

2001

fDate

2001

Firstpage

421

Lastpage

424

Abstract

In this paper, we will discuss the application of a portable Residual Gas Analyzer (RGA) for characterizing and troubleshooting diffusion furnaces and rapid thermal anneal (RTA) reactors in the thermal module at Kilby Fab (KFAB) of Texas Instruments Inc. The tools characterized were Tokyo Electron Ltd. (TEL) vertical atmospheric furnaces, TEL vertical LPCVD furnaces and Applied Materials (AMAT) Rapid Thermal Annealers and Rapid Thermal Processors. Some aspects of the coordination of this operation in a manufacturing environment will also be discussed

Keywords

chemical analysis; chemical vapour deposition; furnaces; portable instruments; rapid thermal annealing; semiconductor technology; diffusion furnace; portable residual gas analyzer; rapid thermal anneal reactor; rapid thermal annealer; rapid thermal processor; residual gas analysis; semiconductor manufacturing; semiconductor thermal processing module; vertical LPCVD furnace; vertical atmospheric furnace; Chemistry; Furnaces; Inductors; Instruments; Monitoring; Pressure control; Rapid thermal annealing; Rapid thermal processing; Sampling methods; Semiconductor device manufacture;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Symposium, 2001 IEEE International

Conference_Location

San Jose, CA

Print_ISBN

0-7803-6731-6

Type

conf

DOI

10.1109/ISSM.2001.963005

Filename

963005