DocumentCode :
1840593
Title :
ORCA: a high speed, high density FPGA architecture
Author :
Krambeck, R.H. ; Chen, C.T. ; Tsui, R.Y.
Author_Institution :
AT&T Bell Labs., Allentown, PA, USA
fYear :
1993
fDate :
22-26 Feb. 1993
Firstpage :
367
Lastpage :
372
Abstract :
The Optimized Reconfigurable Cell Array (ORCA) is an SRAM-based field programmable gate array (FPGA) architecture that makes FPGAs attractive in applications that were previously reserved for gate arrays. The ORCA has an architecture that assures dense layouts of all major types of functionality needed, including data path, random logic, and SRAM. The ORCA FPGA utilizes a novel approach to routing interconnect to achieve a 40% to 100% increase in density over traditional SRAM-based FPGA architectures. The resulting compaction of logic functions into fewer programmable logic cells coupled with dedicated fast arithmetic circuits permits system clock rates of 80 MHz. The ORCA software was designed in parallel with the architecture to insure that all of the benefits of the architecture would be accessible to users through the algorithms of the software. This eliminates the need for users to obtain a detailed knowledge of the architecture in order to use it efficiently. Instead, high-density, high-speed designs are produced automatically by software, with virtually no need for manual intervention on the part of the user.<>
Keywords :
SRAM chips; digital arithmetic; logic arrays; reconfigurable architectures; 80 MHz; ORCA; Optimized Reconfigurable Cell Array; SRAM-based field programmable gate array; data path; dedicated fast arithmetic circuits; dense layouts; high speed, high density FPGA architecture; interconnect routing; logic functions compaction; programmable logic cells; random logic; system clock rates; Compaction; Computer architecture; Field programmable gate arrays; Integrated circuit interconnections; Logic functions; Programmable logic arrays; Programmable logic devices; Random access memory; Reconfigurable logic; Routing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Compcon Spring '93, Digest of Papers.
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-8186-3400-6
Type :
conf
DOI :
10.1109/CMPCON.1993.289697
Filename :
289697
Link To Document :
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