Title :
Validity of mutual inductor model for electromagnetic coupling between vias in integrated-circuit packages and printed circuit boards
Author :
Zhao, Jin ; Fang, Jiayuan
Author_Institution :
Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA
Abstract :
The procedure of extracting mutual inductor model between vias is demonstrated. Then the validity of the mutual inductor model is studied by comparing the solution from the mutual inductor model with that from the full-wave field simulation. It is found that the valid frequency range of the mutual inductor model is mostly determined by the lowest resonant frequency of the package structure
Keywords :
electromagnetic coupling; inductors; integrated circuit packaging; printed circuit design; electromagnetic coupling; full-wave field simulation; integrated-circuit packages; mutual inductor model; package structure; printed circuit boards; resonant frequency; valid frequency range; Coupling circuits; Electromagnetic coupling; Electromagnetic modeling; Electronics packaging; Inductors; Integrated circuit packaging; Mutual coupling; Power supplies; Printed circuits; Resonant frequency;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678849
