Title :
Interconnects for nanoelectronics
Author :
Wang, Kang L. ; Khitun, Alexander ; Flood, Amar H.
Author_Institution :
Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
Abstract :
In the nanoelectronics era with ever smaller devices and higher densities, there are challenges of signal transmission and information communications via interconnects. We examine the interconnect issues for both charge-based and spin-based information systems. For charge-based systems, since there are substantial activities in optical interconnect, this paper focuses on other concepts and approaches. Self-assembled molecular wires, carbon nanotubes/nanowires and virus engineered metallic wires can be used for interconnects. The use of new nano-architectures such as cellular automata, which use mostly nearest neighbors, make the use of self-assembled interconnects even more attractive. These techniques may be applied readily to molecular devices. Spin-based devices offer a new opportunity for low power, high functional throughput applications. We analyze the use of spin waves for information transmission buses referred to as spin wave bus. By introducing these novel circuits built on the spin-based devices and spin wave interconnect, we anticipate enhanced logic functionality. The challenges and issues are discussed.
Keywords :
carbon nanotubes; cellular automata; integrated circuit interconnections; magnetoelectronics; molecular electronics; nanoelectronics; nanowires; self-assembly; spin waves; tunnelling; carbon nanotubes; carbon nanowires; cellular automata; charge-based information systems; molecular electronics; nanoelectronics interconnects; self-assembled interconnects; self-assembled molecular wires; spin wave-based information transmission bus; spin-based information systems; spintronics; tunneling; virus engineered metallic wires; Carbon nanotubes; Information systems; Integrated circuit interconnections; Nanoelectronics; Nanowires; Optical interconnections; Power engineering and energy; Power system interconnection; Self-assembly; Wires;
Conference_Titel :
Interconnect Technology Conference, 2005. Proceedings of the IEEE 2005 International
Print_ISBN :
0-7803-8752-X
DOI :
10.1109/IITC.2005.1499994