DocumentCode
1840991
Title
An analytical characterization and reliability testing of an adhesion enhancing Zn-Cr leadframe coating for popcorn prevention
Author
Lee, Charles ; Hösler, Wolfgang ; Cerva, Hans ; von Criegern, Rolf ; Parthasarathi, A.
Author_Institution
Sch. of Mater. Sci. & Eng., New South Wales Univ., Kensington, NSW, Australia
fYear
1998
fDate
25-28 May 1998
Firstpage
1154
Lastpage
1161
Abstract
A novel Zn-Cr (A2) leadframe coating has been developed and demonstrated to be an effective solution in eliminating popcorn cracking. In this investigation, the A2-coating structure and molding compound (MC)/Cu leadframe (LF) interface was analyzed by Transmission Electron Microscopy (TEM) and Time-of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS). The A2-coating was found to be a thin, partly crystalline layer comprising a continuous interfacial layer and a network of whiskers. The TOF-SIMS and TEM results have identified Zn silicate compound, ZnO and Cr oxide(s) as possible phases present in the coating. The effect of temperature cycling, pressure cooker testing, moisture pre-conditioning, and overheating on the A2 adhesion and degradation mechanism was investigated using a lead pull test. The adhesion data showed that the A2-enhanced MC/Cu LF adhesion is resistant to thermomechanical stress and moisture degradation. The wetting of the molding compound and mechanical interlocking offered by the whiskers are believed to be key factors of adhesion enhancement. Degradation of the A2-enhanced MC/Cu LF adhesion was observed at 300°C after 100 mins exposure through Cu oxide formation by Cu outward diffusion. This was verified by Auger Electron Spectroscopy (AES) analysis operated in the depth profiling mode. Lead pull test specimens were mechanical cleaved to have access to the MC/Cu LF interface for Rutherford Backscattering Spectroscopy (RBS) analysis to identify the locus of failure for various samples
Keywords
Auger electron spectra; Rutherford backscattering; adhesion; chromium alloys; environmental testing; failure analysis; integrated circuit packaging; integrated circuit reliability; mechanical testing; protective coatings; secondary ion mass spectra; thermal stress cracking; transmission electron microscopy; wetting; zinc alloys; 100 min; 300 C; A2 leadframe coating; AES analysis; Auger electron spectroscopy; CrO; Cu; Cu outward diffusion; Cu oxide formation; CuO; RBS analysis; Rutherford backscattering spectroscopy; TEM; Zn-Cr leadframe coating; ZnCr; ZnO; adhesion data; adhesion enhancing coating; analytical characterization; continuous interfacial layer; degradation mechanism; depth profiling mode; failure identification; lead pull test; mechanical interlocking; moisture pre-conditioning; molding compound/Cu leadframe interface; overheating; popcorn cracking; popcorn prevention; pressure cooker testing; reliability testing; secondary ion mass spectrometry; temperature cycling; thermomechanical stress resistance; time-of-flight SIMS; transmission electron microscopy; wetting; whiskers network; Adhesives; Chromium; Coatings; Crystallization; Degradation; Mass spectroscopy; Moisture; Testing; Transmission electron microscopy; Zinc oxide;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location
Seattle, WA
ISSN
0569-5503
Print_ISBN
0-7803-4526-6
Type
conf
DOI
10.1109/ECTC.1998.678862
Filename
678862
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