Title :
The evaluation of high-reliability adhesive film for T-BGA
Author :
Otsuka, Masashi ; Yamagata, Osamu ; Imoto, Takashi ; Takano, Terunari ; Takahashi, Kenji ; Nakayoshi, Hideo
Author_Institution :
Microelectron. Center, Toshiba Corp., Kawasaki, Japan
Abstract :
In the volume production of Tape Ball Grid Array (T-BGA), prevention of delamination between the polyamide tape and the adhesive film has been a serious challenge to the semiconductor packaging community. Since the delamination usually causes solder ball short during the solder reflow process, it is necessary to clarify the mechanism of the delamination as well as to improve the characteristics of the adhesive film. With a view to secure the stable productivity and reliability of the package, we investigated the three following physical characteristics of the adhesive in an attempt to acquire the optimal adhesive solution: resistance to reflow delamination; thermal fatigue; and longer storage life
Keywords :
adhesion; adhesives; delamination; integrated circuit packaging; integrated circuit reliability; microassembling; polymer films; reflow soldering; thermal stress cracking; T-BGA package; ball grid array; delamination prevention; evaluation methods; fatigue failure; high-reliability adhesive film; peel strength; polyamide tape; polyimide film; reflow delamination resistance; semiconductor packaging; soak condition; solder balls; solder reflow process; storage life; stress simulation; tape BGA package; thermal expansion; thermal fatigue; thermal mismatch; thermosetting adhesive; volume production; Delamination; Fatigue; Polyimides; Production; Productivity; Rubber products; Semiconductor device packaging; Semiconductor films; Thermal expansion; Thermal resistance;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678864
