FOUP cleaning - FOSB transportation: a challenge for manufacturing on 300 mm wafers

Author

Frickinger, Jürgen ; Bügler, Jürgen ; Zielonka, Gerhard ; Ryssel, Heiner ; Dudenhausen, Hans-Martin ; Fritzsche, Mike ; Shopbell, Marlin

Author_Institution

Fraunhofer Inst. of Integrated Circuits, Erlangen, Germany

fYear

2001

fDate

2001

Firstpage

491

Lastpage

494

Abstract

With the advent of full minienvironment technology in mass production, FOUP (front opening unified pod) and FOSB (front opening shipping box) become critical points in semiconductor manufacturing. Cleaning of FOUPs and transportation effects seem to have a major influence on the quality of the interior of such minienvironments. Cleanability of FOUPs was investigated in this study. Different components of FOUPs were analyzed individually and different cleaning tools were used for cleaning the FOUPs. A special procedure revealed critical parts in the architecture of the FOUPs and in the performance of the cleaning tools. Preliminary transportation experiments point towards electrostatic effects during shipping of wafers

Keywords

clean rooms; electrostatics; integrated circuit manufacture; materials handling; surface cleaning; 300 mm; 300 mm wafers; FOSB transportation; FOUP cleaning; IC manufacturing; cleanability; cleaning tools; electrostatic effects; front opening shipping box; front opening unified pod; mass production; minienvironment technology; pilot line production; semiconductor manufacturing; wafer shipping; Cleaning; Contamination; Integrated circuit technology; Manufacturing; Powders; Semiconductor device manufacture; Silicon; Testing; Transportation; Water pollution;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Symposium, 2001 IEEE International

Conference_Location

San Jose, CA

Print_ISBN

0-7803-6731-6

Type

conf

DOI

10.1109/ISSM.2001.963022

Filename

963022