Development of the next generation Si wafer transfer/stock system

Author

Kanechika, Yukihiro ; Kawaguchi, Takashi ; Nagase, Masaaki ; Jimbo, Toshihiko ; Yamasaki, Masahiro ; Hirayama, Masaki ; Shirai, Yasuyulu ; Ohmi, Tadahiro

Author_Institution

New Ind. Creation Hatchery Center, Tohoku Univ., Sendai, Japan

fYear

2001

fDate

2001

Firstpage

495

Lastpage

498

Abstract

Clean room air contains many kinds of contaminants such as moisture and organic compounds. The device performance is influenced by them, therefore, Si wafers should not be exposed to clean room air. We have developed the next generation Si wafer transfer/stock system using out-gas free advanced resin and CDA (Clean Dry Air). The advanced resin has various advantageous properties for a Si wafer transfer box and stocker. For example, (1) out-gas free, (2) light weight, (3) high transparency, (4) high strength, etc. Using the advanced resin, we have developed a new Si wafer transfer pod, called BORP (Bottom Opening Removal Pod)

Keywords

ULSI; clean rooms; elemental semiconductors; integrated circuit manufacture; materials handling; polymers; silicon; BORP; Si; Si wafer transfer/stock system; ULSI devices; bottom opening removal pod; clean dry air; clean room air exposure; out-gas free advanced resin; ultra large scale integration; wafer transfer pod; Argon; Electronic mail; Electronics industry; Industrial electronics; Moisture; Monitoring; Organic compounds; Pollution measurement; Resins; Ultra large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Symposium, 2001 IEEE International

Conference_Location

San Jose, CA

Print_ISBN

0-7803-6731-6

Type

conf

DOI

10.1109/ISSM.2001.963023

Filename

963023