Improvement of 300mm FOUP mini-environment

Author

Seita, Hisaharu ; Fujii, Atsuhiro ; Suzuki, Tatsuya ; Kimoto, Shinyo ; Shippou, Osamu ; Fujiwara, Keiji ; Tokunaga, Kenji

Author_Institution

Semicond. Leading Edge Technol. Inc., Yokohama, Japan

fYear

2001

fDate

2001

Firstpage

503

Lastpage

506

Abstract

Evaluates both mechanical and process characteristics of FOUPs (front opening unifed pods) and improves performance through feedback to suppliers. Issues of FOUPs are as follows.: dimensions; FOUP/LP interoperability; particle contamination; organic contamination; and drying defectiveness We have developed 3-dimensional FOUP measuring equipment with Nikon Instech Co. (Nexiv450N) and measured critical dimensions like wafer teeth height, Y52, and latch key hole position. With the Nexiv450N we could take the dimensions of each FOUP to their nominal values. It´s important to align the dimension of the FOUP to realize FOUP/load port interoperability

Keywords

clean rooms; conveyors; drying; integrated circuit manufacture; 300 mm; FOUP mini-environment; Nexiv450N; Nikon Instech; critical dimensions; dimensions; drying defectiveness; front opening unifed pods; latch key hole position; load port interoperability; mechanical characteristics; organic contamination; particle contamination; process characteristics; wafer teeth height; Cleaning; Contamination; Feedback; Lead compounds; Particle measurements; Pollution measurement; Position measurement; Rails; Shape measurement; Teeth;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Symposium, 2001 IEEE International

Conference_Location

San Jose, CA

Print_ISBN

0-7803-6731-6

Type

conf

DOI

10.1109/ISSM.2001.963025

Filename

963025