DocumentCode :
1841132
Title :
Process Control Monitor to Device Data Correlation
Author :
Snowden, Laird R., Jr.
Author_Institution :
AT&T Microelectronics, GaAs Wafer Test
Volume :
27
fYear :
1995
fDate :
34820
Firstpage :
74
Lastpage :
82
Abstract :
Process Control Monitor (PCM) to device modeling is used as an aid in selecting wafers for testing to meet high throughput demands. It can also be used to check for design centering and to facilitate lot starts to meet demand. The output from the model is based on early information provided from PCM testing of the wafer during wafer fabrication. Additionally, the model output can be used to provide an FMA flag, for wafers that have low yield when they are predicted to have high yield. Wafers have limits on PCM parameters. It was found, however, that these limits did not always guarantee a good wafer.
Keywords :
FETs; Fabrication; Gallium arsenide; Monitoring; Phase change materials; Predictive models; Process control; Production; Semiconductor device modeling; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
ARFTG Conference Digest-Spring, 45th
Conference_Location :
Orlando, FL, USA
Print_ISBN :
0-7803-5686-1
Type :
conf
DOI :
10.1109/ARFTG.1995.327108
Filename :
4119785
Link To Document :
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