DocumentCode :
1841181
Title :
Low power consumption molded gigabit fiberoptic transceiver module
Author :
Go, Hisao ; Nishiyama, Naoki ; Tsumura, Eiji ; Fujimura, Yasushi ; Nakanishi, Hiromi ; Tonai, Ichiro ; Nishie, Mitsuaki
Author_Institution :
Optoelectron. R&D Labs., Sumitomo Electr. Ind. Ltd., Yokohama, Japan
fYear :
1998
fDate :
25-28 May 1998
Firstpage :
1192
Lastpage :
1198
Abstract :
The standardization task of gigabit Ethernet by IEEE802.3z working group is attracting a great deal of attention. The demands for the modules compliant with the standardized specification will be increased. We have successfully developed gigabit fiberoptic transceiver modules compliant with 1000BASE-LX, proposed specification in gigabit Ethernet. The main feature of this module is 3.3 V operation which leads to low power consumption, while most of the conventional modules operate at 5.0 V. We used the newly designed package with lower profile 9.4 mm in height. The carefully designed module´s package was formed by transfer mold encapsulation techniques which contribute to the cost reduction. In this paper, the design, assembling process, and characteristics of the developed module are described
Keywords :
assembling; encapsulation; local area networks; moulding; optical fibre communication; packaging; transceivers; 1000BASE-LX; 3.3 V; 9.4 mm; assembling process; cost reduction; gigabit Ethernet; gigabit fiberoptic transceiver modules; moulded modules; power consumption; standardized specification; transfer mold encapsulation techniques; Assembly; Costs; Energy consumption; Ethernet networks; High speed optical techniques; Optical fiber devices; Packaging; Power supplies; Transceivers; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
ISSN :
0569-5503
Print_ISBN :
0-7803-4526-6
Type :
conf
DOI :
10.1109/ECTC.1998.678872
Filename :
678872
Link To Document :
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