Long wavelength transparent epoxy mold optical data link

Author

Tonai, Ichiro ; Fukuoka, Takashi ; Mikamura, Yasuki ; Mizue, Toshio ; Takagi, Daisuke ; Irie, Takeshi ; Kono, Ichiro

Author_Institution

Sumitomo Electr. Ind. Ltd., Yokohama, Japan

fYear

1998

fDate

25-28 May 1998

Firstpage

1199

Lastpage

1205

Abstract

Optical data links have been spreading widely over various data communication networks. Inexpensive data links are required for further infiltration into communication networks. To meet the market demand, we developed data links with transfer molding technology in 1990 and with flexible printed circuit boards in 1995, respectively. Based on these technologies, transparent epoxy molded optical data links have been developed for further cost reduction. Optical and electrical devices are assembled on a lead frame and molded with transparent epoxy, which works as a package and a lens at the same time. The data link is designed to be used at data rates up to 155.52 Mbps or 200 Mbps

Keywords

moulding; optical fibre networks; optical links; packaging; 155.52 Mbit/s; 200 Mbit/s; cost reduction; data rates; fibre communication networks; lead frame; optical data link; package; transparent epoxy mold; Assembly; Communication networks; Costs; Data communication; Flexible printed circuits; Lenses; Optical devices; Optical fiber networks; Packaging; Transfer molding;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components & Technology Conference, 1998. 48th IEEE

Conference_Location

Seattle, WA

ISSN

0569-5503

Print_ISBN

0-7803-4526-6

Type

conf

DOI

10.1109/ECTC.1998.678874

Filename

678874