Title :
Long wavelength transparent epoxy mold optical data link
Author :
Tonai, Ichiro ; Fukuoka, Takashi ; Mikamura, Yasuki ; Mizue, Toshio ; Takagi, Daisuke ; Irie, Takeshi ; Kono, Ichiro
Author_Institution :
Sumitomo Electr. Ind. Ltd., Yokohama, Japan
Abstract :
Optical data links have been spreading widely over various data communication networks. Inexpensive data links are required for further infiltration into communication networks. To meet the market demand, we developed data links with transfer molding technology in 1990 and with flexible printed circuit boards in 1995, respectively. Based on these technologies, transparent epoxy molded optical data links have been developed for further cost reduction. Optical and electrical devices are assembled on a lead frame and molded with transparent epoxy, which works as a package and a lens at the same time. The data link is designed to be used at data rates up to 155.52 Mbps or 200 Mbps
Keywords :
moulding; optical fibre networks; optical links; packaging; 155.52 Mbit/s; 200 Mbit/s; cost reduction; data rates; fibre communication networks; lead frame; optical data link; package; transparent epoxy mold; Assembly; Communication networks; Costs; Data communication; Flexible printed circuits; Lenses; Optical devices; Optical fiber networks; Packaging; Transfer molding;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678874
